Launching Ceremony of Easy BUD
The BUD Fund is to provide funding support for Hong Kong enterprises in exploring and developing the Mainland, Free Trade Agreements (“FTAs”) and Investment Promotion and Protection Agreements (“IPPAs“) markets through developing brands, upgrading and restructuring their operations and promoting domestic sales. To strengthen the support to enterprises in enhancing their competitiveness and developing diversified markets, the cumulative funding ceiling per enterprise under the BUD Fund has been increased to HK$7,000,000, the geographical coverage has extended to 37 economies and 75% of total approved government funding as initial payment.
To speed up the vetting process of BUD Fund applications and encourage more SMEs to make use of the funding to develop their business, the Government is launching "Easy BUD", which simplifies the application form, requirements for supporting documents and vetting process based on the foundation of BUD Fund. It enables SMEs to seize business opportunities. The maximum funding amount for each approved project under "Easy BUD" is HK$100,000.
To mark the launch of “Easy BUD”, a launching ceremony was held on 16th June 2023. The implementer introduced the details of “Easy BUD” and several successful grantees were invited to share their experience about project implementation.
Date: 16 June 2023 (Friday)
Time: 16:15 - 17:00
Mode: Live stream
Language: Cantonese
Enquiry: The BUD Fund Implementer | +852 2788 6088 | [email protected]
The event above was finished, please refer to the press release.
Introducing “The BUD Fund - Easy BUD” Simplified Application Track Support Businesses in Seizing Post-pandemic Economic Opportunities (Press Release)
